The problems I encountered with this procedure are as follows; First when the top ‘H’ plate was resting on the heatsink base and I was trying to insert and screw in the thumbscrews the processor was free to slide about, this could be corrected when the top ‘H’ plate had been tightened a bit (provided that you had noticed it), but it more than likely will cause the thermal paste underneath to spread unevenly and result in poor thermal performance.