Both Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have experienced continuous growth in 0.13-micron capacity utilization. While TSMC is already running at full capacity, UMC also expects to reach its full capacity in the fourth quarter of this year, sources said.
UMC, which is running 0.13-micron processing at its 8-inch Fab 8D and 12-inch Fab 12A, is currently seeing a 65-70% utilization rate at the 8-inch fab and 95% at the 12-inch fab.
The company expects to gradually transfer 0.13-micron production capacity to the 12-inch fab from the 8-inch one, and plans to cut its monthly wafer input at the 8-inch fab by about 4.7% quarter-on-quarter to 60,000 units in the third quarter. Meanwhile, monthly input at the 12-inch fab will be raised by 7% quarter-on-quarter to 58,000 units during the same period, sources said.
Source : DigiTimes
The company expects to gradually transfer 0.13-micron production capacity to the 12-inch fab from the 8-inch one, and plans to cut its monthly wafer input at the 8-inch fab by about 4.7% quarter-on-quarter to 60,000 units in the third quarter. Meanwhile, monthly input at the 12-inch fab will be raised by 7% quarter-on-quarter to 58,000 units during the same period, sources said.
Source : DigiTimes
