The asymmetrical arrangement of the chiplets on the one side and the I/O die on the other side of the Ryzen CPUs of the third generation has it quite in itself. In a first video I had already captured the heating of the CPU as a top view in a special infrared video, which you should have seen before for a better understanding. One of the findings found there was that the hotspots are really no longer located in the middle of the CPU, but (also measurable from the outside) above the areas of the chiplet.