X-bit labs have managed to get hold of the Real NV25 Details!!! So what do u think are these's the real details or not.
Hit read more for details. The new NVIDIA graphics chip, just like GeForce3, will be manufactured with 0.15micron technology. However, the number of transistors used in it will reach 63 million, and the working frequency will be increased up to 300MHz. Here the natural question arises: how on earth NVIDIA managed to increase the chip working frequency so greatly without shifting to a new finer manufacturing technology, especially since NV25 should be more architecturally complex than GeForce3? The answer to this question is pretty original: we will see a new packaging in NV25 ? PBGA with integrated heatsink. In other words, NVIDIA decided to enhance the heat dissipation process in order to be able to speed up its chips. For the same purpose, NVIDIA will provide its NV25 chips with a special NVIDIA thermal control system.
NVIDIA will increase the memory (DDR SDRAM) working frequency as well, which will work at 650MHz on the fastest solutions. This way the memory bus bandwidth will make 10.4GB/sec. Memory chips used on the graphics cards (at least on those following the reference design) will feature BGA-packaging. NV25 based graphics cards will get up to 128MB DDR SDRAM. NV25 will feature 4 rendering pipelines with 2 TMUs each. This will make the new chip similar to GeForce3. However, due to higher working frequencies and improved technologies, the fillrate is claimed to equal 4.9 billion AA samples/sec. Besides significantly higher working frequencies, NV25 will boast some fresh new features and technologies, though it will remain very much like its predecessor, GeForce3. First of all, we have to mention Lightspeed Memory Architecture II, the technology aimed at unloading the memory bus. It includes loss-free Z-buffer compression with 4:1 ratio, 2nd generation Occlusion Culling and Quadcache Architecture, which saves even more memory bandwidth.
So for more info warp to X-bit labs
Hit read more for details. The new NVIDIA graphics chip, just like GeForce3, will be manufactured with 0.15micron technology. However, the number of transistors used in it will reach 63 million, and the working frequency will be increased up to 300MHz. Here the natural question arises: how on earth NVIDIA managed to increase the chip working frequency so greatly without shifting to a new finer manufacturing technology, especially since NV25 should be more architecturally complex than GeForce3? The answer to this question is pretty original: we will see a new packaging in NV25 ? PBGA with integrated heatsink. In other words, NVIDIA decided to enhance the heat dissipation process in order to be able to speed up its chips. For the same purpose, NVIDIA will provide its NV25 chips with a special NVIDIA thermal control system.
NVIDIA will increase the memory (DDR SDRAM) working frequency as well, which will work at 650MHz on the fastest solutions. This way the memory bus bandwidth will make 10.4GB/sec. Memory chips used on the graphics cards (at least on those following the reference design) will feature BGA-packaging. NV25 based graphics cards will get up to 128MB DDR SDRAM. NV25 will feature 4 rendering pipelines with 2 TMUs each. This will make the new chip similar to GeForce3. However, due to higher working frequencies and improved technologies, the fillrate is claimed to equal 4.9 billion AA samples/sec. Besides significantly higher working frequencies, NV25 will boast some fresh new features and technologies, though it will remain very much like its predecessor, GeForce3. First of all, we have to mention Lightspeed Memory Architecture II, the technology aimed at unloading the memory bus. It includes loss-free Z-buffer compression with 4:1 ratio, 2nd generation Occlusion Culling and Quadcache Architecture, which saves even more memory bandwidth.
So for more info warp to X-bit labs
