Uttar over at Nvnews.net's forum has posted the full - what he believes is the - NV35 official feature list. I advise you to take it with a barrel of salt and a dead fish as the writer himself stated: "It's PR talk." CineFX ( TM ) Shading Architecture Support for the Microsoft DirectX® 9.0 Pixel Shader 2.0 Support for the DirectX 9.0 Vertex Shader 2.0 Long pixel programs up to 1,024 instructions Long vertex programs up to 256 static instructions with up to 65,536 instructions executed Dynamic, conditional execution and flow control 256-bit advanced memory interface combines a wider memory data path with next generation controller technology for superior performance and throughput. Full 128-bit, studio-quality floating point precision through the entire rendering pipeline with native hardware support for 32 bpp, 64 bpp and 128 bpp rendering modes Accelerated pixel shaders allow for up to 12 pixel shader operations/clock Up to 16 textures per rendering pass Support for sRGB texture format for gamma textures IntellisampleTM performance technology, a Hi-Res compression technology (HCT), increases performance at higher resolutions through advances in compression and anti-aliasing technology. Shadow Volume Accelerator ? accelerates shadow volumes by maintaining them more accurately and discarding useless information. Full nViewTM multi-display technology capability Integrated NTSC/PAL TV encoder supporting resolutions up to 1024x768 without the need for panning with built-in Macrovision copy protection Microsoft Video Mixing Renderer (VMR) creates support for multiple video windows with full video quality and features in each window DVD and HDTV-ready MPEG-2 decoding up to 1920 × 1080i resolutions Dual, integrated 400 MHz RAMDACs for display resolutions up to and including 2048 × 1536 @ 85 Hz Dual DVO ports for interfacing to external TMDS transmitters and external TV encoders Dual internal TMDS encoders (one single and one Dual link) able to drive next-generation flat panel displays with resolutions greater than 1600 × 1200 Digital Vibrance Control 3.0 0.13 micron process technology for higher levels of integration and higher operating clock speeds 40 mm × 40 mm, BGA 1309 flip-chip package Comprehensive Microsoft DirectX® 9.0 (and lower) and OpenGL 1.4 (and earlier) support  DirectX and S3TC texture compression

For the original forum thread warp2 Nvnews.net.