3DVelocity tooks a look at three very different coolers designed to run on Intel's LGA775 platform.

Prior to recent developments like strained silicon, low-k and reductions in die sizes, temperatures seemed to be spiralling out of control, and the continued use of air as a suitable method for cooling seemed less and less likely with each new processor. These technological advancements have prolonged the feasible life of the air-cooled CPU, though for how long is another question.