Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to the technical disclosures divulged to an exclusive group of attendees, Intel also talked about a shift in the company’s design and engineering model based on six strategic pillars -- Process, Architecture, Memory, Interconnect, Security, and Software – which it hopes will allow it to better address the needs of the current computing landscape moving forward. In addition to the architecture and roadmap news, Intel also talked about a new, very interesting 3D packaging technology it is calling “Foveros”...