A leaked Intel internal slide surfaced on Chinese social networks, revealing five new products the company will build on its 10 nm silicon fabrication process. These include the "Alder Lake" heterogenous desktop processor, "Tiger Lake" mobile processor, "Ice Lake" based Xeon Scalable enterprise processors, DG1 discrete GPU, and "Snow Ridge" 5G base-station SoC. Some, if not all of these products, will implement Intel's new 10 nm+ silicon fabrication node that is expected to go live within 2020.

"Alder Lake" is a desktop processor that implements Intel's new heterogenous x86 core design that's making its debut with "Lakefield." The chip features up to 8 larger "Willow Cove" or "Golden Cove" CPU cores, and up to 8 smaller "Tremont" or "Gracemont" cores. This 8-big/8-small combo lets the chip achieve TDP targets around 80 Watts. Next up is "Tiger Lake," Intel's next-generation mobile processor family succeeding "Ice Lake." This microarchitecture implements "Willow Cove" CPU cores in a homogeneous setup, alongside Xe architecture based integrated graphics. "Ice Lake-SP" is Intel's next enterprise architecture that places mature "Sunny Cove" CPU cores in extreme core-count dies. Lastly, there's "Snow Ridge," an SoC purpose built for 5G base-stations. Image quality notwithstanding, these slides don't appear particularly new, and it's likely that COVID-19 has destabilized the roadmap. For instance, "Alder Lake," and "Ice Lake-SP" are expected to be 10 nm++ chips, a node that doesn't go live before 2021.