The Dynatron G666 is a 2U server heatsink buit to handle Intel LGA1366 Xeon processors with a TDP of 130 Watts. In this review Frostytech will be testing the 65mm tall Dynatron G666 with a 200 Watt heat load. The heatsink is built with a 60mm fan embedded at the front, directing airflow through a short stack of aluminum cooling fins which are connected to a copper base plate by three 6mm diameter heatpipes. The space before and after the heatpipes is filled with two narrow strips of skived copper fins for added cooling surface area.