The level of competition in the desktop CPU market has rarely been as intensive as it has been over the last couple of years. When AMD brought its Ryzen processors to market, it forced Intel to reply, and both have consistently battled in multiple areas, including core count, IPC performance, frequency, and ultimate performance. The constant race to improve products, stay ahead of the competition, and meet customers changing needs has also sent the two companies off of the beaten paths at times, developing even wilder technologies in search of that competitive edge.

In the case of AMD, one such development effort has culminated with 3D V-Cache packaging technology, which stacks a layer of L3 cache on top of the existing CCDs L3 cache. Owing to the fact that while additional cache is beneficial to performance, large quantities of SRAM are, well, large, AMD has been working on how to place more L3 cache on a CPU chiplet without blowing out the die size altogether. The end result of that has been the stacked V-Cache technology, which allows the additional cache to be separately fabbed and then carefully placed on top of a chip to be used as part of a processor.